JPH0270499U - - Google Patents
Info
- Publication number
- JPH0270499U JPH0270499U JP14980188U JP14980188U JPH0270499U JP H0270499 U JPH0270499 U JP H0270499U JP 14980188 U JP14980188 U JP 14980188U JP 14980188 U JP14980188 U JP 14980188U JP H0270499 U JPH0270499 U JP H0270499U
- Authority
- JP
- Japan
- Prior art keywords
- duct
- air side
- panel
- case
- outside air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009423 ventilation Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14980188U JPH0270499U (en]) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14980188U JPH0270499U (en]) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270499U true JPH0270499U (en]) | 1990-05-29 |
Family
ID=31422363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14980188U Pending JPH0270499U (en]) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270499U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020077818A (ja) * | 2018-11-09 | 2020-05-21 | 東芝三菱電機産業システム株式会社 | 半導体装置 |
| JP2023174390A (ja) * | 2022-05-27 | 2023-12-07 | パナソニックＩｐマネジメント株式会社 | 充放電装置 |
-
1988
- 1988-11-17 JP JP14980188U patent/JPH0270499U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020077818A (ja) * | 2018-11-09 | 2020-05-21 | 東芝三菱電機産業システム株式会社 | 半導体装置 |
| JP2023174390A (ja) * | 2022-05-27 | 2023-12-07 | パナソニックＩｐマネジメント株式会社 | 充放電装置 |
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